Journal of South China University of Technology (Natural Science Edition) ›› 2005, Vol. 33 ›› Issue (11): 31-36.

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Preparation of Copper Clad Laminaes Based on Polytetraflouroethylene With Blending Modification

Hu Fu-tian  Wen Xiu-fang  Pi Pi-hui  Cheng Jiang  Yang Zhuo-ru,   

  1. College ofChemical and Energy Engineering,South China Univ,ofTech.,Guangzhou 510640,Guangdong,China
  • Received:2005-02-18 Online:2005-11-25 Published:2005-11-25
  • Contact: 胡福田(1968-),男,博士生,讲师,主要从事精细化工与电子品化学的研究 E-mail:hftian2002@163.com
  • About author:胡福田(1968-),男,博士生,讲师,主要从事精细化工与电子品化学的研究
  • Supported by:

    东莞市科技局重点项目(东科(2004)1号)

Abstract:

Copper clad laminates(CCLs)with high performance based on modified polytetrafluoroethylene(PTFE) were prepared by using blended tetrafluoroethylene and hexafluoropopylene(FEP)as the modification resin.The compatibility of the two resins was then analyzed by means of DSC and SEM.Moreover,the efects of coupling agent,resin content and glass cloth content on the main properties of CCLs were investigated.Th e micro-structure of the cross-sections of CCLs based on the PTFE with or without modification were finally explored.Th e results show that there is excellent compatibility between PTFE and FEP,and that,after the modification by blending,the peeling strength of CCLs increases from 1.8 kN/m to 2.26 kN/m,and the flexural strength increases from 100 MPa to 134 MPa.while the dielectric dissipation factor decreases from 8×10-4 to 7×10-4

Key words: polytetrafluoroethylene, copper clad laminate, blending, modification, peeling strength, flexural strength