Journal of South China University of Technology(Natural Science Edition) ›› 2021, Vol. 49 ›› Issue (2): 88-98,109.doi: 10.12141/j.issn.1000-565X.200428

Special Issue: 2021年流体动力与机电控制工程

• Fluid Power & Electromechanical Control Engineering • Previous Articles     Next Articles

Application and Technology Prospects of Hydrodynamic-Magnetic Compound Support for Axial Piston Pump

JIANG Jihai DU Boran ZHANG Jian   

  1. School of Mechatronics Engineering,Harbin Institute of Technology,Harbin 150001,Heilongjiang,China
  • Received:2020-07-24 Revised:2020-09-11 Online:2021-02-25 Published:2021-02-01
  • Contact: 姜继海 ( 1957-) ,男,博士,教授,主要从事流体传动研究。 E-mail:jjhlxw@hit.edu.cn
  • About author:姜继海 ( 1957-) ,男,博士,教授,主要从事流体传动研究。
  • Supported by:
    Supported by the National Key R&D Program of China ( 2018YFB2000900)

Abstract: Firstly,the development background and research significance of axial piston pump were described,and friction pair was pointed out as the key factor to restrict the development of axial piston pump. Then the research status of friction pair of axial piston pump at home and broad and the problems in current research were summarized. After that,the technical background,principle,development and application prospect of hydrodynamic-magnetic compound support ( HMCS) applied in axial piston pump was introduced. It was showed that the successful application of HMCS in axial piston pump can solve the difficult problems in traditional piston pump technology. Finally,the key technologies and research difficulties faced by the realization of the hydrodynamic-magnetic compound support were prospected,and the relevant research achievements that are helpful to conquer the key technologies were summarized. The hydrodynamic-magnetic compound support is of great theoretical significance and practical application value for the axial piston pump with high reliability and low viscosity medium using.

Key words: piston pump, friction pair, hydrodynamic-magnetic compound support, reliability, low viscosity medium

CLC Number: