Journal of South China University of Technology (Natural Science Edition) ›› 2007, Vol. 35 ›› Issue (12): 56-60.

• Mechanical Engineering • Previous Articles     Next Articles

Image-Splicing Technology for IC Chip Inspection Based on Direction-Predicting Operator of Grading 8 Neighborhoods

Liang Zhong-wei  Ye Bαng-yan  Peng Rui-tao  Xu Lan-ying   

  1. School of Mechanical Engineering , South China Univ. of Tech. , Guangzhou 510640 , Guangdong , China
  • Received:2007-01-22 Online:2007-12-25 Published:2007-12-25
  • Contact: 梁忠伟(1978-) ，男，博士生，主要从事机器视觉、图像处理研究. E-mail:Izwstalin@126.com
  • About author:梁忠伟(1978-) ，男，博士生，主要从事机器视觉、图像处理研究.

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Abstract:

In the accurate optical inspection of the IC chip , it is necessary to obtain complete and accurate images describing the surface features of the chip. For this purpose , a template matching method based on the directionpredicting operator of grading 8 neighborhoods is proposed and is then applied to the high-accuracy image splicing of the IC chip. By quickly and accurately searching the matching pixel in the overlapping part of the microscopic
image , high-speed splicing of IC chip images is implemented. Experimental results indicate that the proposed method helps to obtain clear microscopic surface images of the IC chip as well as display effectively its topography and micro-flaws.

Key words: chip inspection, splicing, direction-predicting operator, template matching