Journal of South China University of Technology (Natural Science Edition) ›› 2014, Vol. 42 ›› Issue (11): 25-30,39.doi: 10.3969/j.issn.1000-565X.2014.11.005

• Mechanical Engineering • Previous Articles     Next Articles

Effect of Ethylene Glycol on Lapping of Sapphire Wafer by Using Fixed Abrasive Pad

Wang Jian-bin Zhu Yong-wei Ju Zhi-lan Xu Jun Zuo Dun-wen   

  1. College of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 210016,Jiangsu,China
  • Received:2014-03-28 Revised:2014-08-19 Online:2014-11-25 Published:2014-11-17
  • Contact: 朱永伟(1967-)，男，教授，博士生导师，主要从事超精密加工技术研究． E-mail:meeywzhu@nuaa.edu.cn
  • About author:王建彬(1982-)，男，博士生，安徽工程大学讲师，主要从事硬脆材料超精密加工技术的研究．E-mail:wjb@ahpu．edu．cn
  • Supported by:

    国家自然科学基金资助项目(51175260， 51375237);南京航空航天大学中央高校基本科研业务费专项资金资助项目(NP2012516)

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Abstract:

The chemical additives in lapping slurry play a vital role in the efficient ultra- smooth machining of sap- phire wafer.In the investigation,the lapping experiment of sapphire wafer was performed by using a fixed abrasive pad,and the effects of the ethylene glycol concentration in lapping slurry on the material removal rate (MRR) and surface morphology of sapphire wafer were discussed.Then,the micro/nano- indentation technique and the photoe- lectron spectroscopy (XPS) were employed to analyze the physical and chemical properties of lapped wafer surface.The results indicate that (1) when the lapping slurry contains 5% ethylene glycol,the depth of surface- modified layer on the lapped wafer surface is about 3.90 nm,and is superior to that in the deionized water,which is 1.04 nm; and (2) higher ethylene glycol content can promote the surface- modified layer to form,which helps to improve the lapping efficiency and enhance the surface quality.

Key words: fixed abrasive, ethylene glycol, sapphire, surface- modified layer, material removal rate

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