关键词: 表面微功能结构, 散热器, 对流换热, 辐射换热

Abstract:

The development demand for electronic products, characterized by miniaturization, lightweight, and low cost, poses significant challenges to the design and manufacturing of heat dissipation modules. To address the heat dissipation challenges of thin and high-performance routers, the paper conducted experiments to analyze and compare the heat dissipation characteristics of seven specifications of aluminum plates under natural convection and micro-convection conditions. The results indicate that under natural convection conditions, for heat source powers ranging from 3-6W, the heat dissipation performance of square pin-fin  aluminum plates is optimal, compared to smooth surface aluminum plates, the average Nusselt number increases by approximately 18%, and the product of heat transfer coefficient and heat transfer area increases by about 17%, resulting in a decrease in heat source temperature by approximately 2°C; round pin-fin aluminum plate compared with the smooth surface aluminum plate, the average Nussel number is increased by 7%, the product of heat transfer coefficient and heat transfer area is increased by about 5%, and the heat source is reduced by about 1.3℃. Surface treatment further enhances the heat dissipation performance, with sandblasted square pin-fin aluminum plates leading to a temperature reduction of 2-3.9°C, and nano-carbon-coated square pin-fin structured aluminum plates resulting in temperature reductions of 5.3-8.6°C; with sandblasted round pin-fin aluminum plates leading to a temperature reduction of 1.9-2.5°C, and nano-carbon-coated square pin-fin structured aluminum plates resulting in temperature reductions of 4.9-7.7°C. Meanwhile, under micro-convection conditions with a wind speed of 2m/s, round pin-fin aluminum plates exhibit optimal heat dissipation performance,compared to smooth surface aluminum plates, the average Nusselt number increases by approximately 8%, and the temperature of the heat source can be reduced by 3.6°C at 6W, with an 18% reduction in thermal resistance; square pin-fin aluminum plate  compared to smooth surface aluminum plates, the average Nusselt number increases by approximately 6%, and the temperature of the heat source can be reduced by 2.4°C at 6W, with an 11% reduction in thermal resistance. As the heat source power increases, aluminum plates with surface microstructural features demonstrate better heat dissipation performance compared to smooth surface aluminum plates.

Key words: microstructure, heat sink, convective heat transfer, radiation heat transfer