Journal of South China University of Technology(Natural Science) >

2023 , Vol. 51 >Issue 3: 98 - 109

DOI: https://doi.org/10.12141/j.issn.1000-565X.220324

Electronics, Communication & Automation Technology

Thermal Fatigue Simulation and Reliability Analysis of High Density CCGA

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  • 1.School of Electronic and Information Engineering，South China University of Technology，Guangzhou 510640，Guangdong，China
    2.The Fifth Electronics Research Institute of the Ministry of Industry and Information Technology，Guangzhou 511370，Guangdong，China
王小强（1982-），男，博士生，高级工程师，主要从事集成电路质量与可靠性测评研究。E-mail:ps＿800@126.com

Received date: 2022-05-31

  Online published: 2022-10-09

Supported by

the Key Research and Development Project of Guangdong Provincial Science and Technology Department(2020B0404030005)

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Abstract

With the characteristics of excellent electrothermal performance and high-density signal interconnection, ceramic column grid array (CCGA) packaging is the first choice in highly reliable applications such as aerospace.When the pin exceeds 1 000, due to the packaging form and the characteristics of the material itself, high-density CCGA is more likely to fail in the environment of temperature change.The paper carried out temperature cycling test for CCGA1144 structure, and studied the stress distribution, variation law, failure cause and mode of welding column through microstructure observation and finite element simulation under the temperature cycling condition of -55~125 ℃. The results show that the variation range of total deformation, equivalent stress, equivalent elastic strain and plastic strain of outer ring welding column is larger than that of inner ring welding column in the process of temperature cycle, and it is more prone to failure, especially the edge welding column of outer ring. The paper identified the weakness of welding column in the thermal fatigue test and pointed out that the two sections of 0.15~0.60 mm and 2.17~2.43 mm are the dangerous areas of crack and fracture failure, and the latter section is more prone to crack and fracture. It put forward three failure modes of thermal fatigue of welding column, and pointed out that the welding column was damaged under the joint action of fatigue mechanism and creep mechanism. Suggestions on the direction of reinforcement and optimization design were given.The research results have guiding significance and reference value for the quality improvement, development and application of high-density CCGA.

Key words： CCGA; thermal fatigue; finite element; temperature cycle; failure

Cite this article

WANG Xiaoqiang, LI Bin, DENG Chuanjin, et al . Thermal Fatigue Simulation and Reliability Analysis of High Density CCGA[J]. Journal of South China University of Technology(Natural Science), 2023 , 51(3) : 98 -109 . DOI: 10.12141/j.issn.1000-565X.220324

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