Study on Heat Transfer Characteristics of Aluminum Plates with Different Surface Micro-Functional Structures

doi:10.12141/j.issn.1000-565X.240208

Abstract

Abstract:

The development needs of miniaturization, lightness and low cost of electronic products have posed significant challenges to the design and manufacture of heat dissipation modules. In order to solve the heat dissipation pro-blem of thin high-performance routers and small electronic devices, 6 kinds of aluminum plate radiators with surface micro-functional structures were designed on the basis of smooth aluminum plate radiators. According to the newly designed aluminum plate radiators, an experimental test platform was built. Under the conditions of natural convection and micro-convection, the heat dissipation performance of the 6 new aluminum plate radiators was compared with that of the smooth aluminum plate radiators. The results show that under the condition of natural convection, when the heat source power is 3.0~6.0 W, the heat dissipation performance of the square pin-fin aluminum plate is the best. Compared with the smooth surface aluminum plate, the average Nusselt number is increased by about 18%, the product of heat transfer coefficient and heat transfer area is increased by about 17%, and the heat source temperature is reduced by about 2.0 K. Compared with smooth surface aluminum plate, the average Nusselt number of round pin-fin aluminum plate increases by 7%, the product of heat transfer coefficient and heat transfer area increases by about 5%, and the heat source decreases by about 1.3 K. After surface treatment, the sandblasted square pin-fin aluminum plate can reduce the heat source temperature by 2.0~3.9 K, and the nano-carbon square pin-fin aluminum plate can reduce the heat source temperature by 5.3~8.6 K. The sandblasted round pin-fin aluminum plate can reduce the heat source temperature by 1.9~2.5 K, and the nano-carbon round pin-fin aluminum plate can reduce the heat source temperature by 4.9~7.7 K. Under the micro-convection condition of wind speed of 2 m/s, the round pin-fin aluminum plate has the best heat dissipation performance. Compared with the smooth surface aluminum plate, the average Nusselt number is increased by about 8%, the temperature of the heat source is reduced by 3.6 K at 6 W, and the thermal resistance is reduced by 18%. Compared with the smooth surface aluminum plate, the average Nusselt number of the square pin-fin aluminum plate is increased by about 6%, the temperature of the heat source can be reduced by 2.4 K at 6 W, and the thermal resistance is reduced by 11%. The higher the heat source power, the better the heat dissipation performance of the aluminum plate with surface micro-functional structure compared with the smooth surface aluminum plate.

Key words: surface micro-functional structure, heat sink, convective heat transfer, radiation heat transfer

CLC Number:

TK124

LI Yong, WANG Huipan, HE Jiabin, JIANG Kejun, CHEN Xinyu. Study on Heat Transfer Characteristics of Aluminum Plates with Different Surface Micro-Functional Structures[J]. Journal of South China University of Technology(Natural Science Edition), 2025, 53(4): 61-71.

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Table 1

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项目	型号	参数
加热棒		额定电压：30 V 额定功率：120 W
绝热电木		导热系数：0.023 W/（m·K）
笔记本电脑	惠普
程控电源	HSPY-30-05	电压精度：0.1% 电流精度：0.5%
K型热电偶		精度：±0.5 K
温度采集卡	NI 9213
静音风机	DV-25NS1C
导热硅脂	S606C	导热系数：5 W/（m·K）

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