Journal of South China University of Technology (Natural Science Edition) ›› 2015, Vol. 43 ›› Issue (4): 143-148.doi: 10.3969/j.issn.1000-565X.2015.04.021

• Physics • Previous Articles    

Heat Conduction Model of Thermoelectric Cooler and its Application to Nonuniform Heat Flux

Zhu Ren-jiang1 Pan Ying-jun1 Jiang Mao-hua2,3 Fan Si-qiang2,3 Zhang Peng2,3   

  1. 1． Key Laboratory of Opto-Electronic Technology and System of the Ministry of Education，Chongqing University，Chongqing 400044，China; 2． College of Physics and Electronic Engineering，Chongqing Normal University，Chongqing 401331，China;
    3． Chongqing High Education Key Laboratory of Optoelectronic Materials and Engineering，Chongqing 401331，China
  • Received:2014-05-23 Revised:2014-08-24 Online:2015-04-25 Published:2015-03-03
  • Contact: 潘英俊(1948-)，男，教授，博士生导师，主要从事光电测控与传感技术、惯性导航技术与系统等研究． E-mail:pyj@cqu.edu.cn
  • About author:朱仁江(1975-)，男，博士生，重庆师范大学副教授，主要从事半导体激光器及其封装技术研究． E-mail: hhzrj@163． com
  • Supported by:

    Supported by the National Natural Science Foundation of China(61008059)

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Abstract: Based on the structure and coupling characteristics of semiconductor thermoelectric cooler，the expression of inner heat source is simplified through separating the responding area of Peltier effect and Joule effect，and a new heat conduction model of thermoelectric cooler is established with the help of elliptic partial differential equation．This model is independent of the physical and geometrical parameters of the thermoelectric couple，and it only needs the standard parameters provided by the producer，so that the numerical analysis of temperature field of nonuniform heat flow can be realized at given current and boundary conditions． Then，the universality of the proposed model is verified by fitting manufacturer’s data． Moreover，with the help of this model，the three-dimension and sectional temperature field distributions in the heat dissipation system of small-size semiconductor power devices with thermoe-lectric cooler are obtained，and the common characteristics of such heat dissipation system is revealed．

Key words: thermoelectric cooler, heat conduction model, nonuniform heat flux, numerical analysis

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