Abstract:

In order to improve the capability of heat shock resistance of electronic devices and ensure the working reliability and stability of the devices,composite paraffin /expanded graphite PCM ( Phase Change Material) was prepared via the physical adsorption,with paraffin as a phase-change energy-storage material and with expanded graphite as a supporting matrix. Then,the product was applied to the thermal management of electronic devices,and the performance of a temperature-controlled heat sink with the composite PCM was investigated by the experiments on a simulated electronic chip. The results show that the thermal conductivity of the composite PCM containing 90% of paraffin is about 5 times that of pure paraffin ( 0. 3608W/( m·K) ),that the PCM filled in the heat sink effectively reduces the heating and cooling rates of the simulated electronic chip and prolongs the temperaturecontrolling time,and that,with the filling of the composite PCM in the heat sink,the temperature-controlling time of the chip at the heating powers of 15 and 20W increases by 59% and 20%,respectively,which reduces the possibility of burning out of electronic chips due to sharp temperature rise and provides the protection of electronic devices.

Key words: phase change material, electronic cooling, paraffin, graphite, temperature control