Abstract:

A kind of composite phase-change material (PCM) possessing rapid thermal response was prepared , with paraffin as the phase-change material and with porous expanded graphite of high thermal conductivity as the supporting material. The product with a thermal conductivity up to 4. 676 W / ( m . K) was then applied to the heat sinks of electronic devices. The results show that the apparent heat transfer coefficients of the PCM-based testing system at different heating powers are 1. 36 - 2. 98 times that of the traditional cooling system , meaning that the PCMbased testing system is of better cooling performances and is capable of effectively improving the resistance to highloading heat shock. Thus , the operation reliability and stability of electronic devices can be effectively ensured.

Key words: phase-change material, thermal property, electronic device, cooling