Journal of South China University of Technology (Natural Science Edition) ›› 2018, Vol. 46 ›› Issue (11): 39-46.doi: 10.3969/j.issn.1000-565X.2018.11.006

• Materials Science & Technology • Previous Articles     Next Articles

Research on Thermal Performance Of Bi-In-Sn-Sb Quaternary Alloy Interface Materials

 LI Jing1， 2 CHEN Xuyang1 LEI Rubai1 ZHANG Ding1 FAN Chunlei1   

  1. 1． School of Chemistry and Chemical Engineering，South China University of Technology，Guangzhou 510640，Guangdong，China;
    2． SCUT-Zhuhai Institute of Modern Industrial Innovation，Zhuhai 519175，Guangdong，China
  • Received:2018-03-07 Revised:2018-07-24 Online:2018-11-25 Published:2018-10-02
  • Contact: 李静( 1966) ，女，博士，教授，主要从事强化传热及新材料等的研究 E-mail:ljing@scut.edu.cn
  • About author:李静( 1966) ，女，博士，教授，主要从事强化传热及新材料等的研究
  • Supported by:
    The National Natural Science Foundation of China( 51476193，51176053) and the“13th Five-Year Plan”Civil Aerospace Technology Pre-Ｒesearch Project of the State Administration of Science，Technology，and Industry for National Defense( 501-01-2018-0167，A2180150) 

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Abstract: Alloy interface materials with excellent thermal contact resistance elimination rate are widely used in the electronics industry to improve the thermal conductivity between material contact surfaces. In this paper, a novel Bi-In-Sn-Sb quaternary alloy was fabricated by adding a small amount of expandable metal Sb to Bi-In-Sn ternary alloy and smelting it in a tube furnace at 700 ℃. This alloy has a low melting point (~ 61 ℃), high thermal conductivity (~ 23.8 W m-1 k-1) and extremely low thermal contact resistance (~ 12.3 mm2 K W-1). The eliminating efficiency of thermal resistance between ceramic substrates is up to 95.9%, which can greatly improve the heat transfer performance between the substrates. The results show that the volumetric expansion rate of Bi-In-Sn-Sb quaternary alloy is as high as 88.6% after phase change (at 80 ℃), which can effectively reduce the residue of air gap between interfaces and improve the quality of contact surfaces. Therefore, the expandable phase change Bi-In-Sn-Sb quaternary alloy most likely becomes a good candidate of high performance thermal interface materials.

Key words: interface materials, Bi-In-Sn-Sb quaternary alloy, phase change, thermal contact resistance, expansion rate

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