Journal of South China University of Technology(Natural Science Edition) ›› 2022, Vol. 50 ›› Issue (3): 88-94,126.doi: 10.12141/j.issn.1000-565X.210219

Special Issue: 2022年机械工程

• Mechanical Engineering • Previous Articles     Next Articles

Multiphysics Coupling Simulation of ECM Temperature Based on Different Turbulence Models

CHEN Yuanlong1 IN Hua1,2 CHEN Peixuan1 LI Huigui1   

  1. 1.School of Mechanical Engineering, Hefei University of Technology, Hefei 230009, Anhui, China;
    2.School of Mechanical and Automotive Engineering, West Anhui University, Luan 237000, Anhui, China
  • Received:2021-04-16 Revised:2021-06-23 Online:2022-03-25 Published:2022-03-01
  • Contact: 陈远龙(1964-),男,教授,博士生导师,主要从事特种加工工艺及装备研究。 E-mail:Chenyuanlong@hfut.edu.cn
  • About author:陈远龙(1964-),男,教授,博士生导师,主要从事特种加工工艺及装备研究。
  • Supported by:
    Supported by the National Natural Science Foundation of China(51775161,51775158)and the Natural Science Foundation of Anhui Province(2008085QE278)

Abstract: In view of the difficulties in the prediction and measurement of machining gap temperature distribution in the process of electrochemical machining (ECM), this paper established and analyzed a temperature multiphy-sics coupling model for profile ECM. The turbulence models of SA, k-ε, k-ω, SST and low-Reynolds-number k-ω were used to calculate the flow field distribution, and the temperature distribution was obtained by coupling electrical field, flow field and temperature field. The simulated value was compared with the experimental value. Results show that the near-wall region flow field solution accuracy of the low-Reynolds-number wall treatment is higher than that of the wall-function and the temperature in the ECM gap can reach a quasi-stable state in a relatively short time. The calculated temperature values based on SST and low-Reynolds-number k-ω models are very close to each other, and the simulated temperature values of the model coupled with the bubble rate are closer to the experimental values.

Key words: turbulence model, ECM, multiphysics coupling, convection heat transfer, low-Reynolds-number

CLC Number: