In order to dissipate the high heat flux of microelectronic chips,a heat column with composite capillary wick was designed by manufacturing stagger microgrooves at the evaporation and the condensation ends of the heat column via ploughing-extrusion ( P-E) and by sintering a layer of copper fiber on the microgrooves. Then,the effects of P-E parameters on the formation of microgrooves at the evaporation end,as well as the effects of sintering
parameters on the sintering layer,were discussed by comprehensively analyzing the forming process of the wick. The results show that ( 1) the surface morphology of microgrooves becomes better at a large P-E depth or a suitable microgroove distance in a certain range; ( 2) the optimal boiling-enhanced microgroove structure is obtained at a cutting feed of 0. 45mm/r,an interior angle of radial microgroove of 3° and a P-E depth of 0. 3mm; ( 3) the optimal condensation-enhanced microgroove structure is obtained at a P-E depth of 0. 3 mm,a cutting feed of 0. 50mm/r and an axial micro groove spacing of ( 1 /180) rad; and ( 4) the sintered layer is of the optimal sintering performance and the strongest conjuncting ability to the tube wall when it is sintered with a heating rate of 5℃ /s at 950℃ for 60min.