Mechanical Engineering

Study on Heat Transfer Characteristics of Aluminum Plates with Different Surface Micro-Functional Structures

  • LI Yong ,
  • WANG Huipan ,
  • HE Jiabin ,
  • JIANG Kejun ,
  • CHEN Xinyu
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  • 1.School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,Guangdong,China
    2.China Mobile Communication Group Terminal Co. ,Ltd. ,Beijing 102206,China
李勇(1974—),男,博士,教授,主要从事微功能结构、相变器件设计制造及传热性能等研究。E-mail:meliyong@scut.edu.cn

Received date: 2024-04-28

  Online published: 2024-07-22

Supported by

the Natural Science Foundation of Guangdong Province(2023A1515011635);the Gateway Router Product Heat Dissipation Key Technical Cooperation Project(D8230630)

Abstract

The development needs of miniaturization, lightness and low cost of electronic products have posed significant challenges to the design and manufacture of heat dissipation modules. In order to solve the heat dissipation pro-blem of thin high-performance routers and small electronic devices, 6 kinds of aluminum plate radiators with surface micro-functional structures were designed on the basis of smooth aluminum plate radiators. According to the newly designed aluminum plate radiators, an experimental test platform was built. Under the conditions of natural convection and micro-convection, the heat dissipation performance of the 6 new aluminum plate radiators was compared with that of the smooth aluminum plate radiators. The results show that under the condition of natural convection, when the heat source power is 3.0~6.0 W, the heat dissipation performance of the square pin-fin aluminum plate is the best. Compared with the smooth surface aluminum plate, the average Nusselt number is increased by about 18%, the product of heat transfer coefficient and heat transfer area is increased by about 17%, and the heat source temperature is reduced by about 2.0 K. Compared with smooth surface aluminum plate, the average Nusselt number of round pin-fin aluminum plate increases by 7%, the product of heat transfer coefficient and heat transfer area increases by about 5%, and the heat source decreases by about 1.3 K. After surface treatment, the sandblasted square pin-fin aluminum plate can reduce the heat source temperature by 2.0~3.9 K, and the nano-carbon square pin-fin aluminum plate can reduce the heat source temperature by 5.3~8.6 K. The sandblasted round pin-fin aluminum plate can reduce the heat source temperature by 1.9~2.5 K, and the nano-carbon round pin-fin aluminum plate can reduce the heat source temperature by 4.9~7.7 K. Under the micro-convection condition of wind speed of 2 m/s, the round pin-fin aluminum plate has the best heat dissipation performance. Compared with the smooth surface aluminum plate, the average Nusselt number is increased by about 8%, the temperature of the heat source is reduced by 3.6 K at 6 W, and the thermal resistance is reduced by 18%. Compared with the smooth surface aluminum plate, the average Nusselt number of the square pin-fin aluminum plate is increased by about 6%, the temperature of the heat source can be reduced by 2.4 K at 6 W, and the thermal resistance is reduced by 11%. The higher the heat source power, the better the heat dissipation performance of the aluminum plate with surface micro-functional structure compared with the smooth surface aluminum plate.

Cite this article

LI Yong , WANG Huipan , HE Jiabin , JIANG Kejun , CHEN Xinyu . Study on Heat Transfer Characteristics of Aluminum Plates with Different Surface Micro-Functional Structures[J]. Journal of South China University of Technology(Natural Science), 2025 , 53(4) : 61 -71 . DOI: 10.12141/j.issn.1000-565X.240208

References

1 BURAK K, MECIT S .Heat transfer enhancement using U-shaped flow routing plates in cooling printed circuit boards[J].Journal of the Brazilian Society of Mechanical Sciences and Engineering201840(1):13/1-14.
2 GHASEMI E S, RANJBAR A A, Hosseini M J .Experimental evaluation of cooling performance of circular heat sinks for heat dissipation from electronic chips using nanofluid[J].Mechanics Research Communications201784:85-89.
3 SADEGHI H, IZADPANAH E, RABIEE B M,et al .Effect of cylinder geometry on the heat transfer enhancement of power-law fluid flow inside a channel[J].Journal of the Brazilian Society of Mechanical Sciences and Engineering201739(5):1695-1707.
4 KIM K, WON M, KIM J,et al .Heat pipe cooling technology for desktop PC CPU[J].Applied Thermal Engineering200323(9):1137-1144.
5 KHORUNZHII I, GABOR H,JOB R,et al .Model-ling of a pin finheat converter with fluid cooling for power semiconductor modules[J].International Journal of Energy Research200327:1015-1026.
6 唐恒,汤勇,伍晓宇,等 .表面功能结构制造研究的新进展与发展趋势[J].机械工程学报202258(11):183-199.
  TANG Heng, TANG Yong, WU Xiaoyu,et al .New progress and development trend of manufacturing of functional surface structure[J].Journal of Mechanical Engineering202258(11):183-199.
7 汤勇,周明,韩志武 .表面功能结构制造研究进展[J].机械工程学报201046(23):93-105.
  TANG Yong, ZHOU Ming, HAN Zhiwu,et al . Recent research on manufacturing technologies of functional surface structure[J].Journal of Mechanical Engineering201046(23):93-105.
8 ALAM W M, BHATTACHARYYA S, SOUAYEH B,et al .CPU heat sink cooling by triangular shape micro-pin-fin:numerical study[J].International Communications in Heat and Mass Transfer2020112:104455/1-8.
9 HUANG S, ZHU H, ZHENG Y,et al .Compound thermal performance of an arc-shaped inner finned tube equipped with Y-branch inserts[J].Applied Thermal Engineering2019152:475-481.
10 CHIN S,FOO J, LAI Y,et al .Forced convective heat transfer enhancement with perforated pin fins[J].Heat and Mass Transfer201349(10):1447-1458.
11 GREGORCIC P, ZUPANCIC M, GOLOBIC I .Scala-ble surface microstructuring by a fiber laser for con-trolled nucleate boiling performance of high and low-surface-tension fluids[J].Scientific Reports20188(1):7461/1-8.
12 DJAMEL S, LAHCENE B, AISSA Y,et al .Numerical investigation and optimization of a heat sink ha-ving hemispherical pin fins[J].International Communications in Heat and Mass Transfer2021122:105133/1-16.
13 NURAISYAH S R, ADNAN I, AHMAD F,et al .Performance enhancement of photovoltaic modules with passive cooling multidirectional tapered fin heat sinks (MTFHS)[J].Case Studies in Thermal Engineering202350:103400/1-8.
14 陆龙生,刘晓辰,邓大祥 .多孔壁面沟槽的犁切-热处理成形机理[J].华南理工大学学报(自然科学版)201240(1):35-39,57.
  LU Long-sheng, LIU Xiao-chen, DENG Da-xiang .Formation mechanism of porous grooves on tube walls by ploughing-heat treatment[J].Journal of South China Univ-ersity of Technology (Natural Science Edition)201240(1):35-39,57.
15 ZHAO Y Q, SONG Y N, ZHUANG N L,et al .Optimization design of surface microstructure of high-efficiency space radiation heat dissipation fins[J].An-nals of Nuclear Energy2023182:109590/1-13.
16 王乐,吴珂,俞益波,等 .自然对流条件下LED阵列散热器改进研究[J].光电子·激光201122(3):338-342.
  WANG Le, WU Ke, YU Yi-bo,et al . Study on LED array heat radiator improvement under natural convection[J].Optoelectronic Laser201122(3):338-342.
17 YOUSFI A, SAHEL D, MELLAL M,Effects of a pyramidal pin fins on CPU heat sink performances[J].Journal of Advanced Research in Fluid Mechanics and Thermal Sciences201963 (2):260-273.
18 刘剑洪,吴双泉,何传新,等 .碳纳米管和碳微米管的结构、性质及其应用[J].深圳大学学报理工版201330(1):1-11.
  LIU Jianhong, WU Shuangquan, HE Chuanxin,et al .Structure,properties and applications of carbon nanotubes and carbon micron tubes[J].Journal of Shenzhen University (Science and Technology Edition)201330(1):1-11.
19 PONGIANNAN K S, RAMALINGAM V, NAGENDRAN L .Natural-convection heat transfer enhancement of aluminum heat sink using nanocoating by electron beam method[J].Thermal Science201923(5B):3129-3141.
20 MANDAL S, DEB A,SEN D .Mixed convective heat transfer with surface radiation in a rectangular channel with heat sources in presence of heat spreader[J].Thermal Science and Engineering Progress201914:100423/1-7.
21 杨世铭,陶文栓 .传热学[M].北京:高等教育出版社,2006:41-60.
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