Materials Science & Technology

Preparation and Performance Study of Tri-Component Copolymerized High Dielectric Performance Polyimide

  • CAO Xianwu ,
  • YAO Zhiqiang ,
  • HUANG Qilong ,
  • ZENG Peipei ,
  • ZHAO Wanjing
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  • School of Mechanical and Automative Engineering/Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing/National Engineering Research Center of Novel Equipment for Polymer Processing/The Key Laboratory of Polymer Processing Engineering of Ministry of Education,South China University of Technology,Guangzhou 510640,Guangdong,China
曹贤武(1970 —),男,教授,博士生导师,主要从事高性能聚合物介电材料和绝缘材料、高分子材料加工成型技术研究。E-mail: ppeme@scut.edu.cn

Received date: 2024-01-29

  Online published: 2024-06-19

Supported by

the National Natural Science Foundation of China(52173035)

Abstract

At present, with the development of the energy field, the requirements for capacitors continue to increase. Capacitors with high temperature performance and high energy storage have become a research hotspot. High energy storage density requires high dielectric constant and low dielectric loss. The special engineering material polyimide (PI) is favored by people because of its high temperature resistance, but its low energy storage density restricts its application. In order to make better use of the high temperature resistance of polyimide and find an excellent synthesis route from the diversity of its synthetic raw materials, this paper aimed to prepare polyimide (PI) with high dielectric constant and low dielectric loss, and study the effect of isomer 2,3,3',4'-biphenyltetracarboxylic dianhydride (a-BPDA) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA) on the dielectric properties of polyimide. Using a-BPDA, s-BPDA, 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), 4'-bis (3-aminophenoxy) diphenyl sulfone (m-BAPS) as raw material, PI film was prepared by ternary copolymerization, so as to verify the feasibility of the scheme. On this basis, the proportion of raw materials was allocated to explore the best performance of various raw material ratios. The films were characterized by FTIR analysis, XRD analysis, thermal performance analysis and dielectric performance analysis. The experimental results show that a-BPDA, s-BPDA, BTDA and m-BAPS can successfully synthesize polyimide films. The synthesized films still have high thermal properties. a-BPDA and s-BPDA increase the glass transition temperature of polyimide to 245.8 ℃ and 239.1 ℃, respectively. s-BPDA and a-BPDA have different effects on the dielectric properties of polyimide. When the ratio of s-BPDA to BTDA is 3∶2, the dielectric constant of sPI was 4.25 and the dielectric loss is 0.002 9 at 1 000 Hz. When the ratio of a-BPDA to BTDA is 3∶2, the dielectric constant of aPI is 3.49 and the dielectric loss is 0.002 3. Under comprehensive comparison, s-BPDA is more effective in improving the thermal and dielectric properties of polyimide.

Cite this article

CAO Xianwu , YAO Zhiqiang , HUANG Qilong , ZENG Peipei , ZHAO Wanjing . Preparation and Performance Study of Tri-Component Copolymerized High Dielectric Performance Polyimide[J]. Journal of South China University of Technology(Natural Science), 2025 , 53(1) : 92 -100 . DOI: 10.12141/j.issn.1000-565X.240053

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