Mechanical Engineering

Microstructure and Mechanical Properties of Al 7075 Alloy Prepared by Cryogenic-Temperature Extrusion Machining
 

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  •  School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,Guangdong,China
殷晓龙( 1989-) , 男,博士生,主要从事金属切削及其数值模拟技术的研究

Received date: 2018-08-02

  Revised date: 2018-12-26

  Online published: 2019-04-01

Supported by

Supported by National Natural Science Foundation of China( 51375174) and the Natural Science Foundation of Guangdong Province( s2013050014163, 2017A030313260) 

Abstract

 Large amounts of heat generate during the preparation of ultrafine grained materials,which may decrease the strength of materials. In order to solve this problem,a new method named cryogenictemperature extrusion machining ( CT-EM) was put forward. In this method,Al 7075 alloy was chosen as the workpiece material and roomtemperature extrusion machining ( RT-EM) was also conducted for a comparison in terms of chip morphology,microstructure and mechanical properties. The results indicate that ( 1) the chips prepared by CT-EM and RT-EM are continuous and segmented,respectively; ( 2) the surface of the chip obtained by CT-EM possesses fewer defects with better integrity; ( 3) the maximum hardness of CT-EM and the RT-EM samples are 190 ( HV,the same as follows) and 175,respectively,which are far greater than that of the original material ( 105) ; ( 4) after the CT-EM process,the grains are highly refined to less than 200 nm in diameter; ( 5) the grain refinement and dislocation strengthening are two main strengthening mechanisms for Al 7075 alloy; and ( 6) as CT-EM Al 7075 alloy possesses higher dislocation density,the contribution of dislocation strengthening to hardness is greater. 

Cite this article

YIN Xiaolong DENG Wenjun ZHANG Jiayang PI Yunyun .

Microstructure and Mechanical Properties of Al 7075 Alloy Prepared by Cryogenic-Temperature Extrusion Machining
 
[J]. Journal of South China University of Technology(Natural Science), 2019 , 47(5) : 89 -95 . DOI: 10.12141/j.issn.1000-565X.180396

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