Architecture & Civil Engineering

Approaches to Abating Coincidence Effect of Sound Insulation by Using Double-Leaf Wall Structure
 

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  •  1. College of Civil Engineering and Architecture∥Guangxi Key Laboratory of Disaster Prevention and Engineering Safety∥Key Laboratory of Disaster Prevention and Structural Safety of Ministry of Education,Guangxi University, Nanning 530004,Guangxi,China
黄险峰( 1965-) ,男,博士,教授,主要从事建筑声学研究.

Received date: 2017-09-08

  Revised date: 2018-01-08

  Online published: 2018-03-01

Supported by

 Supported by the National Natural Science Foundation of China( 51568003) and the Natural Science Foundation of Guangxi( 2015GXNSFAA139254,2014GXNSFAA118017) 

Abstract

Double-leaf wall structure with its favorable sound insulation is widely used in variety building envelopes. Once coincidence superposition which occurs within some frequency ranges will severely impair the sound insulation of this structure. For the purpose to eliminate the effects of coincidence superposition,statistical energy analysis ( SEA) theory is adopted in predicting sound insulation of the specific double-leaf wall. The results indicate that structural coincidence effect can be predicted accurately by SEA model,therefore,the suitable double-leaf wall structures which attenuate coincidence effect are obtained,that is,the influence of the coincidence effect on the sound insulation will be abated by altering the sequence,density and thickness of each material layer of a doublelayer wall. For instance,the thin panel towards sound source can effectively reduce coincidence effect which generates sound insulation deterioration of the structure and the coincidence effects at low and high frequency ranges are attenuated substantially whilst both the walls of double-leaf wall are light-weight panels. 

Cite this article

HUANG Xianfeng LIU Jun .

Approaches to Abating Coincidence Effect of Sound Insulation by Using Double-Leaf Wall Structure
 
[J]. Journal of South China University of Technology(Natural Science), 2018 , 46(4) : 105 -111 . DOI: 10.3969/j.issn.1000-565X.2018.04.015

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