Materials Science & Technology

Infiltrants for Post-Processing of Three-Dimension Printing Specimens

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  • 1. School of Chemistry and Chemical Engineering,South China University of Technology,Guangzhou 510640,Guangdong,China;2. Foshan Heyu Chemical Co. ,Ltd. ,Foshan 528313,Guangdong,China; 3. Department of Light Chemical Engineering,Guangdong Industry Technical College,Guangzhou 510300,Guangdong,China
程江(1965-),男,博士,教授,主要从事精细化工研究.

Received date: 2014-07-01

  Revised date: 2014-09-05

  Online published: 2014-12-31

Supported by

Supported by the Project of Integration of Industry,Education and Research of Guangdong Province and Ministry of Education of China(2012B091100442)

Abstract

This paper deals with the water resistance,compressive strength,dimensional deviation and surficial mi-crostructure of gypsum-based three-dimension printing specimens affected by filling enhancers(namely infiltrant A),base materials of infiltrant B,dosage of waterborne epoxy emulsion in infiltrant B and immersion time. The re-sults show that(1) nano-silicone superhard curing agent is the most suitable enhancer for infiltrant A because it sig-nificantly improves the compressive strength of printing specimens; (2) waterborne polyurethane emulsion PU-202B is the most appropriate base material of infiltrant B; (3) the addition of waterborne epoxy emulsion in infiltrant B improves the compressive strength and water resistance of printing specimens,but excess waterborne epoxy emulsion may result in a dimensional deviation of the specimens; (4) the best immersion time for the three-dimension print-ing specimens into infiltrants A and B is 130s and 35s,respectively; and (5) after being immersed in infiltrant A and subsequently in infiltrant B,the specimens are of high compressive strength,weak water absorption,smooth surface and strong bond capability.

Cite this article

Cheng Jiang Wu Jiao-jiao Xu Shou-ping Zhou Dong-wei Zhou Liang . Infiltrants for Post-Processing of Three-Dimension Printing Specimens[J]. Journal of South China University of Technology(Natural Science), 2015 , 43(2) : 144 -150 . DOI: 10.3969/j.issn.1000-565X.2015.02.022

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