目前高分子材料成型方法都采用高温塑化、低温成型的成型机理进行加工． 这一 过程消耗了大量的能量，并造成聚合物及其添加剂的热降解，降低了塑料的性能和可回收 性． 因此，文中在聚合物热压成型加工中引入高频电场，使物料在正应力和高频电场协同 作用下实现低温塑化，研究物料在高频电场中发生热响应的压力、温度依赖性，以及在临 界塑化温度点下制备的聚合物片材的力学性能，建立合理的温升模型． 研究表明: 材料极 性越强，其介电损耗越高，物料吸热能力越强; 极性材料和非结晶性聚合物吸热量随成型 压力的增大而增大，而非极性的结晶性聚合物吸热量存在最佳吸热压力点;均聚物具有最 佳吸热温度点，而多相的共聚物吸热量随加工温度呈指数增长;施加高频电场试样的拉伸 性能显著提升，证实了协同低温塑化行为的存在． 

 Currently，polymer materials are processed by high temperature plasticizing and low temperature molding． These processing needs to spend a lot of energy and causes the degradation of polymers and additives， reducing product performances and recovery． Therefore，this article introduces highfrequency electric field into hotpressing process of polymers，making the materials plasticize in synergism of normal stress field and highfrequency electric field at low temperature． The dependence of pressure and temperature on thermalresponse of polymer materials to the high frequency electric field，as well as the mechanical properties of pure polymer plates which are prepared at critical plasticizing temperature point， is studied in depth; a model of temperaturerising is also reasonably established． The results show that the stronger polarity of polymer materials， the higher dielectric loss and absorbed heat will be; the absorbed heat of polar materials and amorphous polymer are positively related to the processing pressure，while the absorbed heat of non-polar crystalline materials have the best pressure point in which materials absorb the maximal heat． Homo-polymer have the best temperature points for heat absorption，while the absorbed heat of copolymer exponentially increase with the processing temperature rising． The tensile properties of specimens with highfrequency electric field improved significantly when compared to the specimens without highfrequency electric field，proving the existence of plasticizing behavior at low temperature under the synergism of normal stress field and  highfrequency electric field