三维双连续陶瓷骨架的粘接-复合新技术

华南理工大学学报（自然科学版） ›› 2009, Vol. 37 ›› Issue (3): 25-28.

三维双连续陶瓷骨架的粘接-复合新技术

王娟陈维平何曾先黄丹

华南理工大学机械与汽车工程学院, 广东广州 510640

收稿日期:2008-03-13 修回日期:2008-06-18 出版日期:2009-03-25 发布日期:2009-03-25
通信作者: 陈维平（1959-），男，教授，博士生导师，主要从事新型复合材料制备与成型的研究．E-mail：mewpchen@scut．edu．cn E-mail:sweetjuan1981@163．com
作者简介:王娟（1981-），女，博士生，主要从事Al／Al2O3复合材料的研究．

A Novel Joining-Compounding Technology of 3D Co-Continuous Ceramic Skeleton

Wang Juan Chen Wei-ping He Zeng-xian Huang Dan

School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, Guangdong, China

Received:2008-03-13 Revised:2008-06-18 Online:2009-03-25 Published:2009-03-25
Contact: 陈维平（1959-），男，教授，博士生导师，主要从事新型复合材料制备与成型的研究．E-mail：mewpchen@scut．edu．cn E-mail:sweetjuan1981@163．com
About author:王娟（1981-），女，博士生，主要从事Al／Al2O3复合材料的研究．

摘要/Abstract

摘要： 探索了一种构建三维双连续陶瓷-金属复合材料中陶瓷骨架的新途径.采用基于丝网印刷原理的粘接剂涂布新工艺,对99A l₂O₃陶瓷坯体进行连接,成功实现了复杂空间构型陶瓷骨架的构建.通过SEM表征了陶瓷粘接体粘接界面的微观形貌,探讨了烧制温度对骨架力学性能的影响.结果表明,该工艺有效避免了高温陶瓷粘结剂堵孔的弊病,1 450℃烧结的陶瓷粘接体其抗折强度最佳,结点处的中间层厚度约为250μm.

关键词: 陶瓷-金属复合材料, 网络骨架, 粘接, 连通性

Abstract:

Based on the screen printing mechanism, a novel process to fabricate the complex-shaped ceramic skeleton of 3D co-continuous ceramic-metal composite was investigated by joining 99% Al₂O₃ ceramic in the green state with ceramic slurry. The microstructures of the jointing interface were then characterized by means of SEM, and the effect of sintering temperature on the mechanical properties of the skeleton was also analyzed. The results indicate that the hole-blockage of skeleton can be successfully overcome by the new process, and that the skeleton sintered at 1450 ℃ is of the optimal bending strength and an interlayer thickness of about 250 μm at the joint.

Key words: ceramic-metal composite, network skeleton, joining, connectedness

王娟陈维平何曾先黄丹. 三维双连续陶瓷骨架的粘接-复合新技术[J]. 华南理工大学学报（自然科学版）, 2009, 37(3): 25-28.

Wang Juan Chen Wei-ping He Zeng-xian Huang Dan . A Novel Joining-Compounding Technology of 3D Co-Continuous Ceramic Skeleton[J]. Journal of South China University of Technology (Natural Science Edition), 2009, 37(3): 25-28.