华南理工大学学报(自然科学版) ›› 2008, Vol. 36 ›› Issue (4): 10-13.

• 机械工程 • 上一篇    下一篇

基于热力耦合的滑动摩擦系数模型与计算分析

龚中良 黄平   

  1. 华南理工大学 机械工程学院, 广东 广州 510640
  • 收稿日期:2007-06-07 修回日期:2007-08-05 出版日期:2008-04-25 发布日期:2008-04-25
  • 通信作者: 龚中良(1965-),男,教授,博士后,主要从事摩擦润滑技术及理论研究. E-mail:gzlaa@163.com
  • 作者简介:龚中良(1965-),男,教授,博士后,主要从事摩擦润滑技术及理论研究.
  • 基金资助:

    国家自然科学基金资助项目(50675068);中国博士后科学基金资助项目(20070410819)

Calculating Model and Corresponding Analysis of Sliding Friction Coefficient Based on Thermal Dynamic Coupling

Gong Zhong-liang  Huang Ping   

  1. School of Mechanical Engineering, South China University of Technology, Guangzhou 510640, Guangdong, China
  • Received:2007-06-07 Revised:2007-08-05 Online:2008-04-25 Published:2008-04-25
  • Contact: 龚中良(1965-),男,教授,博士后,主要从事摩擦润滑技术及理论研究. E-mail:gzlaa@163.com
  • About author:龚中良(1965-),男,教授,博士后,主要从事摩擦润滑技术及理论研究.
  • Supported by:

    国家自然科学基金资助项目(50675068);中国博士后科学基金资助项目(20070410819)

摘要: 为预测和控制摩擦过程,通过分析界面原子在界面势能场激励下的热振动,建立了基于摩擦界面热力耦合过程的滑动摩擦系数计算模型.计算分析表明:滑动摩擦系数随相对滑动速度增大而增大;当摩擦界面实际接触面积与载荷呈线性关系时,滑动摩擦系数与接触面积无关;当实际接触面积接近名义接触面积时,滑动摩擦系数随载荷的增加而减小;此外,滑动摩擦系数随晶格常数增大而降低,随原子质量减小而减小.

关键词: 界面原子, 热力耦合, 滑动摩擦系数, 能量耗散, 热振动

Abstract:

In order to forecast and control the friction process, the thermal vibration of interfacial atoms stimulated by the interfacial potential energy field is analyzed, and a calculating model of sliding friction coefficient is established based on the thermal dynamic coupling process. Calculated results indicate that the sliding friction coefficient increases with the relative sliding velocity but has nothing to do with the real contact area of friction surface when the area linearly varies with the load. However, when the real contact area is close to the nominal one, the sliding friction coefficient decreases with the increase of the load, It is also found that, with the increase of crystal lattice constant and the decrease of atomic mass, the sliding friction coefficient decreases.

Key words: interfacial atom, thermal dynamic coupling, sliding friction coefficient, energy dissipation, heat vibration