华南理工大学学报(自然科学版) ›› 2008, Vol. 36 ›› Issue (2): 83-88.

• 机械工程 • 上一篇    下一篇

电磁铸轧中铸嘴支撑面板的温度场及热应力研究

刘年春 毛大恒   

  1. 中南大学 机电工程学院, 湖南 长沙 410083
  • 收稿日期:2007-03-29 修回日期:2007-08-25 出版日期:2008-02-25 发布日期:2008-02-25
  • 通信作者: 刘年春(1978-),男,博士生,主要从事现代连铸轧理论、技术及设备研究. E-mail:nchliu-1@163.com
  • 作者简介:刘年春(1978-),男,博士生,主要从事现代连铸轧理论、技术及设备研究.
  • 基金资助:

    国家“863”计划项目(2001AA337070)

Temperature Field and Thermo-Stress Analyses of Supporting Plane Board for Nozzle in Electro-Magnetic Cast-Rolling Process

Liu Nian-chun  Mao Da-heng   

  1. College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, Hunan, China
  • Received:2007-03-29 Revised:2007-08-25 Online:2008-02-25 Published:2008-02-25
  • Contact: 刘年春(1978-),男,博士生,主要从事现代连铸轧理论、技术及设备研究. E-mail:nchliu-1@163.com
  • About author:刘年春(1978-),男,博士生,主要从事现代连铸轧理论、技术及设备研究.
  • Supported by:

    国家“863”计划项目(2001AA337070)

摘要: 铸嘴支撑面板是电磁铸轧工艺的关键部件,其结构稳定性直接关系到铸嘴的平面稳定性.文中利用ANSYS有限元分析软件建立了铸嘴支撑面板温度-应力耦合分析的三维有限元计算模型,并对实际工况下面板的热应力分布进行了计算.研究结果表明:面板内存在显著的热应力,应力集中现象明显;面板总体上出现了较大的热位移,特别是在竖直方向,热位移量最大,导致面板因变形过大失效.计算值与实测值的良好吻合说明了所提出的模型的有效性.

关键词: 电磁铸轧, 铸嘴支撑面板, 温度场, 热应力, 热位移

Abstract:

The supporting plane board for nozzle is the pivotal component in electro-magnetic cast-rolling technique. Its structural stability greatly affects the stability of nozzle plane. In this paper, a three-dimension finite element calculating model for thermo-stress coupling analysis is developed with the finite element software package AN- SYS and is used to calculate the practical thermo-stress distribution in the supporting nozzle plane board. The resuits show that there exists remarkable thermo-stress in the plane board and distinct stress concentration, and that the thermal displacement in the plane board is rather large, especially in the vertical direction, which may result in the deformation failure of the plane board. The calculated results accord well with the practical measurement, which verifies the effectiveness of the proposed model.

Key words: electro-magnetic cast-rolling, supporting nozzle plane board, temperature field, thermo-stress, thermal displacement