Effect of Via Microstructure on Cu/low-k Stress-Induced Voiding
Lin Xiao-ling Hou Tong-xian Zhang Xiao-wen Yao Ruo-he
Journal of South China University of Technology (Natural Science Edition) . 2011, (3): 135 -139 .  DOI: 10.3969/j.issn.1000-565X.2011.03.026