针对型面电解加工过程中的间隙温度分布难以预测和测量的问题，建立型面二维电解加工温度多物理场耦合仿真模型，分别基于SA、k-ε、k-ω、SST和低雷诺数k-ε等湍流模型求解加工间隙流场分布，耦合电场、流场和温度场求解间隙温度场分布，并将计算值与试验值进行对比。结果表明，求解近壁区流速时采用低雷诺数壁处理比采用壁函数处理的精度高，间隙温升能在较短时间内达到准稳态，基于SST、低雷诺数k-ε模型的间隙温度仿真值非常接近，其耦合气泡的温度多场耦合模型仿真值与试验值更为接近。

In view of the difficulties in the prediction and measurement of machining gap temperature distribution in the process of electrochemical machining (ECM), this paper established and analyzed a temperature multiphy-sics coupling model for profile ECM. The turbulence models of SA, k-ε, k-ω, SST and low-Reynolds-number k-ω were used to calculate the flow field distribution, and the temperature distribution was obtained by coupling electrical field, flow field and temperature field. The simulated value was compared with the experimental value. Results show that the near-wall region flow field solution accuracy of the low-Reynolds-number wall treatment is higher than that of the wall-function and the temperature in the ECM gap can reach a quasi-stable state in a relatively short time. The calculated temperature values based on SST and low-Reynolds-number k-ω models are very close to each other, and the simulated temperature values of the model coupled with the bubble rate are closer to the experimental values.