本文通过熔融盐法制备CuCl2插层的石墨层间化合物（CuCl2-GICs），探讨了加热时间、反应物配比对CuCl2-GIC产物的阶结构、表面形貌及导电性的影响。结果表明，产物含有主阶为1阶的混阶石墨层间化合物和一定量的石墨；延长反应时间有助于增强插层效果；反应物配比对产物的阶结构组成影响较小。插层后的石墨发生了膨胀，在片层的边缘分布着较多的CuCl2颗粒；制备的CuCl2-GICs中CuCl2为非化学计量比，其中[Cl-]离子不足。CuCl2-GICs的电导率较石墨原料有所提升，最大提升80%。

CuCl2-graphite intercalation compounds (CuCl2-GICs) were synthesized in molten CuCl2. The effects of the reaction time and the ratios of the reagents on the stage structure, morphology and electrical properties were investigated in detail. The results show that the synthesized products are mainly the CuCl2-GICs with mixed stages of stage 1 and other stages. Small amounts of graphite are also found in the products. When the reaction time increases, the intercalation effects are enhanced. However, the variations of the ratios of the reagents show little effect on the microstructure of the CuCl2-GICs. The morphology observation indicates that the graphite flakes expand after the intercalation and amounts of CuCl2 are found on the edge of the graphite flakes. The EDS elemental analysis demonstrates that the copper chlorides are nonstoichiometry with a lot of [Cl-] deficiency. The electrical conductivity of the CuCl2-GICs improves when compared to those of the original graphite and a maximum of 80% improvement is achieved.