合金界面材料凭借优异的接触热阻消除率被广泛应用于电子工业, 以提高材料接触面之间的热传导性能. 本文通过在Bi-In-Sn三元合金中添加微量膨胀金属粒子Sb并于管式炉中700 ℃熔融工艺, 制备了一种新奇的Bi-In-Sn-Sb四元合金. 该合金具有较低的熔点(~61 ℃), 较高的导热系数(~23.8 W m-1 k-1)和极低的接触热阻(~12.3 mm2 K W-1), 其对陶瓷基板间界面热阻消除率可达到95.9%, 这能够极大促进基板之间的热传导. 研究发现这是因为Bi-In-Sn-Sb四元合金在相变后体积膨胀率高达88.6% (在80 ℃), 能够有效减少界面之间的空气带隙残留量, 改善接触面质量. 因此, 这种相变膨胀Bi-In-Sn-Sb四元合金最可能成为高性能热界面材料的候选者.

Alloy interface materials with excellent thermal contact resistance elimination rate are widely used in the electronics industry to improve the thermal conductivity between material contact surfaces. In this paper, a novel Bi-In-Sn-Sb quaternary alloy was fabricated by adding a small amount of expandable metal Sb to Bi-In-Sn ternary alloy and smelting it in a tube furnace at 700 ℃. This alloy has a low melting point (~ 61 ℃), high thermal conductivity (~ 23.8 W m-1 k-1) and extremely low thermal contact resistance (~ 12.3 mm2 K W-1). The eliminating efficiency of thermal resistance between ceramic substrates is up to 95.9%, which can greatly improve the heat transfer performance between the substrates. The results show that the volumetric expansion rate of Bi-In-Sn-Sb quaternary alloy is as high as 88.6% after phase change (at 80 ℃), which can effectively reduce the residue of air gap between interfaces and improve the quality of contact surfaces. Therefore, the expandable phase change Bi-In-Sn-Sb quaternary alloy most likely becomes a good candidate of high performance thermal interface materials.