收稿日期: 2015-11-20
修回日期: 2016-07-13
网络出版日期: 2016-12-01
基金资助
国家自然科学基金资助项目( 11574243, 11174231)
Research on Thermal Hysteresis of Silicon-Based Semiconductor
Received date: 2015-11-20
Revised date: 2016-07-13
Online published: 2016-12-01
Supported by
Supported by the National Natural Science Foundation of China( 11574243, 11174231)
孙志刚 何雄 谢晴兴 李月仇 庞雨雨 . 硅基半导体热滞现象的研究[J]. 华南理工大学学报(自然科学版), 2017 , 45(1) : 48 -52 . DOI: 10.3969/j.issn.1000-565X.2017.01.007
In this paper,the electrical transport properties ( V-I characteristics) of Ag /SiO2 /p-Si ∶ B /SiO2 /Ag device at different temperatures are investigated by means of four-wire method,finding that an obvious thermal hysteresis phenomenon occurs in V-I curves at low temperatures.In order to eliminate the experimental errors caused by the thermal hysteresis,two methods of prolonging the interval between two consecutive measurements and improving the heat conduction ability of system are proposed,and the first method is used to remove the effects of the thermal hysteresis on the electrical transport properties of the device.The results show that when the electrical properties and magnetoresistance effects of semiconductor-based materials are investigated,the thermal hysteresis phenomenon should be treated carefully,otherwise it may lead to erroneous results.
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