采用拟合的方法‚并利用 DESTIN 测试系统‚研究了集成电路金属布线电阻与温度的关系；探讨了不同材料、不同尺寸和不同结构金属布线的焦耳热效应；揭示了在加速试验（一定的高电流、高温）条件下金属化自升温较大‚必须考虑焦耳热效应作用的原理；解决了已往用环境温度代替测试结构表面实际温度所带来的误差‚从而更准确地得到了可靠性分析的结果．

By using the fitting method and the DESTIN testing system‚the relationship between the temperature and the resistance of the metal interconnector in integrated circuit （IC） was studied‚and the Joule-heated effect of the metal in-terconnectors with various materials‚sizes and structures were then investigated．It is revealed that in the accelerating test conditions with high current density and high temperature‚the Joule-heated effect must be taken into consideration‚for the metal temperature auto-increases rather rapidly．By the proposed method‚the error caused by the replacement of real temperature in specimen surface by the circumstance temperature can be settled‚thus obtaining the reliability analysis re-sult with more accuracy．