为提高滚压铜的表面性能，采用剧烈塑性变形方式的滚压工艺，通过加大滚压力进行多次滚压，实现了纯铜表层梯度纳米化，并在干摩擦条件下对滚压样和粗晶样进行了球/平面微动磨损实验，考察滚压对组织结构、表面结构和摩擦磨损性能的影响，分析纳米晶铜的磨损机制．结果表明: 所获得的滚压样的表面晶粒尺寸范围为 4 ～18 nm，平均晶粒尺寸约为 9 ～10nm; 滚压样的表面粗糙度从粗晶样的 1．50μm 显著降低到 0．55μm，显微硬度从粗晶样的 52．2 大幅提高到 120．0; 滚压样在实验负载范围内均具有比粗晶样更好的抗摩擦磨损性能; 滚压样在低负载下以磨粒磨损、疲劳磨损为主，在高负载下以磨粒磨损、粘着磨损为主．

In order to improve the surface properties of the burnished copper,a gradient nano- grained surface layer was fabricated by means of a multi- pass burnishing process with a large burnishing force,which can cause a severe plastic deformation.The fretting wear tests were then performed under a dry condition on the burnished copper and the coarse- grained (CG) copper in the forms of ball- on- plane,so as to reveal the influences of burnishing on the microstructure,the surface structure,the friction and wear properties as well as the wear mechanisms of nanocrys-talline copper.The results show that (1) for the burnished samples,the grain size in the topmost burnished surface ranges from 4 nm to 18nm,with an average value of about 9 ～10nm; (2) as compared with the CG copper,the burnished copper is of a significantly- decreased surface roughness,which is from 1.50μm to 0.55μm,and its mi-crohardness greatly increases from 52.2 to 120.0; (3) the friction and wear performance of the burnished copper under the whole range of load is better than that of the CG copper; and (4) the wear forms of the burnished copperare mainly abrasive wear and fatigue wear under low loads and turn to be mainly abrasive wear and adhesive wear under high loads.